STMicroelectronics · Discrete semiconductors
STGB30H60DLFB
TRENCH GATE FIELD-STOP IGBT, HB
STM32-first sourcing with STMicroelectronics support components. Review recorded cores, flash, RAM, connectivity and package facts before moving an approved design into production.
Request this exact part →STGB30H60DLFB specifications
Recorded source facts. Missing values are kept explicit; verify the exact manufacturer document before design approval.
| Manufacturer | STMicroelectronics |
|---|---|
| Ordering code | STGB30H60DLFB |
| Family | Discrete semiconductors |
| Package | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Product Status | Obsolete |
| IGBT Type | Trench Field Stop |
| Voltage - Collector Emitter Breakdown (Max) | 600 V |
| Current - Collector (Ic) (Max) | 60 A |
| Current - Collector Pulsed (Icm) | 120 A |
| Vce(on) (Max) @ Vge, Ic | 2V @ 15V, 30A |
| Power - Max | 260 W |
| Switching Energy | 393µJ (off) |
| Input Type | Standard |
| Gate Charge | 149 nC |
| Td (on/off) @ 25°C | -/146ns |
| Test Condition | 400V, 30A, 10Ohm, 15V |
| Reverse Recovery Time (trr) | Not provided in source |
| Operating Temperature | -55°C ~ 175°C (TJ) |
| Mounting Type | Surface Mount |
| Package / Case | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Supplier Device Package | D²PAK (TO-263) |
Documents and evidence
STGB30H60DLFB ↗Before sourcing STGB30H60DLFB
- Identify the firmware and board baseline
- Check flash, RAM and required peripherals
- Review pin assignment and supply limits
- Keep the full temperature and package suffix
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