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STMicroelectronics · Discrete semiconductors

STGIPS30C60

IGBT IPM MODULE 30A 600V SDIP-25

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STGIPS30C60 component illustration
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STGIPS30C60 specifications

Recorded source facts. Missing values are kept explicit; verify the exact manufacturer document before design approval.

ManufacturerSTMicroelectronics
Ordering codeSTGIPS30C60
FamilyDiscrete semiconductors
Package25-PowerDIP Module (0.993", 25.23mm)
Product StatusObsolete
TypeIGBT
Configuration3 Phase
Current30 A
Voltage600 V
Voltage - Isolation2500VDC
Mounting TypeThrough Hole
Package / Case25-PowerDIP Module (0.993", 25.23mm)

Documents and evidence

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Catalog sources

www.ic-components.com · STGIPS30C60 ↗

Source directory identity match; source detail pending. Specifications remain from existing catalog.

Before sourcing STGIPS30C60

  1. Identify the firmware and board baseline
  2. Check flash, RAM and required peripherals
  3. Review pin assignment and supply limits
  4. Keep the full temperature and package suffix
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Questions about STGIPS30C60

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