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STMicroelectronics · RF ICs & modules

STM32WB55RGV6

ULTRA-LOW-POWER DUAL CORE ARM CO

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STM32WB55RGV6 component illustration
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STM32WB55RGV6 specifications

Recorded source facts. Missing values are kept explicit; verify the exact manufacturer document before design approval.

ManufacturerSTMicroelectronics
Ordering codeSTM32WB55RGV6
FamilyRF ICs & modules
Package68-VFQFN Exposed Pad
Product StatusActive
DigiKey ProgrammableNot Verified
TypeTxRx + MCU
RF Family/Standard802.15.4, Bluetooth
ProtocolBluetooth v5.3, Thread, Zigbee®
ModulationGFSK
Frequency2.405GHz ~ 2.48GHz
Data Rate (Max)2Mbps
Power - Output6dBm
Sensitivity-100dBm
Memory Size1MB Flash, 256kB SRAM
Serial InterfacesADC, I²C, SPI, UART, USART, USB
GPIO49
Voltage - Supply1.71V ~ 3.6V
Current - Receiving3.8mA ~ 7mA
Current - Transmitting8.1mA ~ 13.1mA
Operating Temperature-40°C ~ 85°C (TA)
Mounting TypeSurface Mount
Package / Case68-VFQFN Exposed Pad
Supplier Device Package68-VFQFPN (8x8)

Documents and evidence

STM32WB55RGV6 ↗

Catalog sources

www.ic-components.com · STM32WB55RGV6 ↗

Source directory identity match; source detail pending. Specifications remain from existing catalog.

Before sourcing STM32WB55RGV6

  1. Identify the firmware and board baseline
  2. Check flash, RAM and required peripherals
  3. Review pin assignment and supply limits
  4. Keep the full temperature and package suffix
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Questions about STM32WB55RGV6

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Related records aid discovery. Package, pinout, ratings, tooling and software require engineering approval before substitution.

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